Products Catalog

Specification

Introduction to the Product:
XA090-P1 is equipment that automatically executes precision alignment and cohesion
between layers of boards including Stack Via, Nero Manhattan Bump Interconnection
( NMBI) , Flip-Chip and BGA board which are cutting edge PCB manufacturing
technique.
Now you can experience more efficient product manufacturing with equipment
appropriate for manufacturing technology of advanced engineering.

Applicable subjects:
- Stack via PCB, NMBI ( Neo Manhattan Bump Interconnection) PCB.
- Board for Flip-Chip application
- Board for BGA application

Main Features:
- High precision alignment function ( Resolution : 2§ ­ )
- Mark inspection simulation function
- Manufacturing management / statistics management
- Precision automated calibration function
- Uses closed-tube for which maintenance is convenient
- Measurement for quality management / Provision of analysis program.